The continuous growth of the domestic economy, the continuous increase in the output of electronic products and the global industrial transfer of electronic adhesive products have brought good development opportunities to domestic electronic adhesive companies, and there is room for continuous growth in market demand. Among them, PUR hot melt adhesive plays an important role, and the more subdivided fields have put forward higher and higher precision requirements for the performance of PUR hot melt adhesive. The demand for the electronics market will also point the way for the development of PUR hot melt adhesives in the electronics industry.

The yield of reactive polyurethane hot melt adhesive (PUR) in electronic adhesives was 13.1%. PUR hot melt adhesive is a high bond strength cross-linking structural adhesive. It can be quickly positioned, fast cured, and has strong initial tack strength. It also has the unique water resistance, heat resistance, cold resistance and creep resistance of reactive liquid adhesives. Resistant to media and other properties. In particular, it does not contain water and solvent, and its solid content is 100%. It is a high-performance environmentally friendly adhesive that meets the needs of the environment and the society.

Compared with other electronic glues, PUR hot melt adhesives have strong adhesion and high strength, which can meet the bonding requirements of most electronic products. PUR hot melt adhesives can easily control the thickness of glue; PUR hot melt adhesives are thermoplastic. Polyurethane, which is easy to disassemble and easy to repair with PUR hot melt adhesive bonding products. PUR hot melt adhesive has good fluidity when heated, and is convenient for coating. Its high strength adhesive property can meet the bonding requirements of structural components of mobile electronic products.

Excellent performance makes PUR hot melt adhesive the first choice in the industry for bonding, sealing, laminating, connecting, insulating, electronic protection and assembly. Specific applications include smart phone, tablet screen component assembly, learning machine, GPS Navigator, wearable electronics, window bonding, housing structural bonding, battery bonding, flat sealing, PCB assembly and protection, and more.

01, shell or frame structure bonding

The structural bonding parts used in the assembly of portable electronic equipment are mainly: the structure of the frame structure of the casing, the bonding of the logo and the decorative strip, and the bonding of other metal or plastic parts. Because of the spraying treatment on the tempered screen screen, only the non-corrosive, easy to disassemble and rework adhesive with high bonding strength can be used. Therefore, the PUR hot melt adhesive is particularly suitable for bonding the touch screen to the casing and the frame.

02, electronic components and module potting

Bonding of module power supply, LED outdoor streetlight power supply, vehicle power supply, and other power supplies requiring potting have strict requirements on glue, such as waterproof, dustproof, insulation protection, anti-mechanical damage, temperature shock aging, heat dissipation, protection, etc. , PUR hot melt adhesive has better fluidity when heated, convenient for coating, suitable for electronic component bonding and module potting.

03, common film

The home appliance industry and industrial power supplies generally have components that need to be surface-coated, such as PCB boards. Generally, they also have requirements for waterproofing and dustproofing. The PUR hot-melt adhesive can protect the printed circuit boards used in extreme environments from moisture and moisture. Gas and other adverse conditions, and can be used in any environment and enhance mechanical strength, while protecting the refined lead from heat damage.