HonorSing Advanced Materials Limited
Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Tel: +86 755 23001358 +852 60666694
E-mail:kefu@honorsing.com
SZ Add: H2206 Liuhe Building, No.168 Shenshan Road, Pingshan District, Shenzhen.
HK Add: Rooms 1318-19, 13/F, Hollywood Plaza, 610 Nathan Road, Mongkok, Hong Kong.
Thermal Paste
Thermal putty
| • | High thermal conductivity with low thermal resistance |
| • | "Play-doh" like property, best used where large tolerance differences create |
| • | The need for compression of interface material beyond 50% of its original |
| thickness | |
| • | Low stress on the components naturally tacky and requires no further |
| adhesive coating, which would inhibit thermal performance |
|
| • | Room temperature storage |